BST-AO1-101 automatically loads and unloads trays; using own AOI technology to inspect the post-packaged chips from all eight sides for cosmetic defects—such as ejector-pin marks, transparent-product flaws, and missing or bent gold wires. Defective units are automatically rejected, sorted, and collected in dedicated reject bins.
Key Features:
- 6x high-speed color or black/white CCD camera modules
- Inspection defect on lift copper、broken、turn、empty、crooked and polarity
- High-resolution color camera to improve detection capability
- Friendly U/I and easy setting
- Short conversion time
- Easy maintenance
