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CPO Chip, BGA
CPO Chip, BGA
CPO Chip, BGA
CPO Chip, BGA
CPO Chip, BGA
CPO Chip, BGA
CPO Chip, BGA
CPO Chip, BGA

CPO Chip, BGA

CPO Chip, BGA

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Product Detail

Key Features

  • Support 2 style of DUT feeding – magazine mode, and conveyor JEDEC pallet mode
  • Repair mode support – manual material loading from back side
  • Modular design – AOI cell and material feeding cell, isolate interference to vision inspection. Easy to reuse the core module, and configure with different loading cell
  • Vibration Isolation - compliant with VC-C Standard
  • MSG Laser Auto Fucus 
  • High accuracy marble platform 
  • Plasma cleaning integrated (can be replaced with other cleaning method)
  • Support manual operation mode
  • Programmable AOI and cleaning process
  • Serviceability – convenient with side doors
  • Class 6 clean room supported
  • Auto gripper exchange – vacuum grippe for OE and CPO Chip


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Product Detail

Key Features

  • Support 2 style of DUT feeding – magazine mode, and conveyor JEDEC pallet mode
  • Repair mode support – manual material loading from back side
  • Modular design – AOI cell and material feeding cell, isolate interference to vision inspection. Easy to reuse the core module, and configure with different loading cell
  • Vibration Isolation - compliant with VC-C Standard
  • MSG Laser Auto Fucus 
  • High accuracy marble platform 
  • Plasma cleaning integrated (can be replaced with other cleaning method)
  • Support manual operation mode
  • Programmable AOI and cleaning process
  • Serviceability – convenient with side doors
  • Class 6 clean room supported
  • Auto gripper exchange – vacuum grippe for OE and CPO Chip


CPO Chip, BGA
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CPO Chip, BGA

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