BST-AO1-101

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Product Detail

BST-AO1-101 automatically loads and unloads trays; using own AOI technology to inspect the post-packaged chips from all eight sides for cosmetic defects—such as ejector-pin marks, transparent-product flaws, and missing or bent gold wires. Defective units are automatically rejected, sorted, and collected in dedicated reject bins.

Key Features:

6x high-speed color or black/white CCD camera modules
Inspection defect on lift copper、broken、turn、empty、crooked and polarity
High-resolution color camera to improve detection capability
Friendly U/I and easy setting
Short conversion time
Easy maintenance

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Product Detail

Key Features:

6x high-speed color or black/white CCD camera modules
Inspection defect on lift copper、broken、turn、empty、crooked and polarity
High-resolution color camera to improve detection capability
Friendly U/I and easy setting
Short conversion time
Easy maintenance

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