Testing & Automation
Expert
English
- English
Booster Overview
Semiconductor Test Offerings
Chip Test Handler - Opto Chips
|
Project Brief |
End-to-end optical sensor verification with intelligent grading and reject handling |
|
Product Brief |
Opto Chip |
|
Delivery Location |
CN |
|
Key Features |
● Operation Mode – fully automated feeding AOI, FCT and Taping ● Cycle Time – 7000 UPH ● Tester and handler all in one ● Dual turrets for material transfer ● Compatibility - Support multiple lever testing, chip/die and PCBA ● Material Feeding Technique – üInput from bowl feeder üOutput to tape üAuto pick & place with nozzles ● Modular design – easy for repurpose, platform + change kit to adapt to different products ● Vision embedded – AOI inspection for 6-sides of the chip ● High precision alignment – üFine pitch probing socket to chips ● Serviceability – easy access to system control module |
|
Process Coverage |
● Bowl feeder input ● Centering and orientation alignment ● Vision inspection (top, 5S, 6 sides, in-pocket) ● Electrical functional test (FCT) up to 18 sites - Integrated light source test, air/empty test, and gray card testLaser marking with vision verification ● Tape & reel output with auto-reject and replenishment
|
Turret Test Handler - RF Chips
|
Project Brief |
Automatically tests RF chips (gain, linearity,S‑parameters, etc.) on a high‑speed turret and sorts them by performance |
|
Product Brief |
RF Chips |
|
Delivery Location |
CN |
|
Key Features |
● Parallel Testing: Supports up to 4 test sites in parallel to increase machine UPH for devices with long test times. ● Nozzle Features:Nozzles support skip function and automatic height calibration. ● Automatic Feeding:bowl feeder ● Main Turret:Equipped with 30 servo-driven nozzles that accurately pick and place devices to the center of each station via vacuum suction. ● Laser Marking Station:Supports laser marking, dust vacuuming, and marking vision inspection, significantly improving marking speed. ● Tape & Reel Output:In addition to standard automatic taping, features automatic replenishment (missing part replacement). Optional post-seal vision inspection. ● Pneumatic & Vacuum Features:Supports automatic air path purging and automatic nozzle vacuum detection. ● Core Components:Bowl feeder, test sockets, and other core components are fully manufactured in-house. |
|
Process Coverage |
● Bowl feeder input ● Centering and orientation alignment ● Vision inspection (top, 5S, 6 sides, in-pocket) ● Electrical functional test (FCT) up to 8 sites ● Laser marking with vision verification Tape & reel output with auto-reject and replenishment |
FVI Automatic Inspection Machine - Wafer Ring
|
Project Brief |
Automatically loads the metal ring, picks up the chip for 6-sided vision inspection, sorts the chips into bins, and unloads them onto trays |
|
Product Brief |
Wafer Ring |
|
Delivery Location |
Vietnam |
|
Key Features |
● 6x high-speed color or black/white CCD camera modules ● Inspection defect on lift copper、broken、turn、empty、crooked and polarity ● High-resolution color camera to improve detection capability ● Friendly U/I and easy setting ● Short conversion time ● Easy maintenance ● Imaging with High Resolution Camera |
|
Process Coverage |
● Material Handling & Feeding ● Alignment & Vision Inspection ● Defect Detection (Cosmetic & Structural) ● Rejection & Sorting |
Wafer AOI Machine - Patterned Wafer
|
Project Brief |
Automatically detect and locate pattern defects (such as breaks, bridges, foreign materials, and distortion) on the wafer surface caused by lithography, etching, and other processes |
|
Product Brief |
Patterned Wafer |
|
Delivery Location |
Vietnam |
|
Key Features |
● High-Resolution Defect Detection - Pixel resolution down to 250 nm (BF/DF @20x) for capturing fine defects. ● Multiple Imaging Modes with DIC - Freely configurable bright-field (BF), dark-field (DF), and DIC modes with switchable multi-magnification objectives. ● High-Speed Inspection Efficiency - Detection efficiency up to 100 WPH @2x for 6' wafers, featuring line-scan rapid imaging and online review. ● High Accuracy & Low Overkill Rate - Detection accuracy ≥98%, overkill rate ≤3%. ● Precision Motion Platform - Air-flotation vibration-isolation marble stage with repeatability of X/Y: ±0.5 µm, Z: ±1 µm, and max speed of 500 mm/s. ● Flexible Wafer Size Support - Compatible with 6'/8' and 8'/12' wafers. ● Automated Wafer Handling & Code Reading - Dedicated handling robot with auto edge finder, load mapping, and SEMI-standard OCR auto-code reading. ● Smart Software & Factory Integration - Golden die generation (fully/semi-auto/manual), recipe creation <30 min, auto/manual review, MES/EAP integration, and process data analysis. |
|
Process Coverage |
● Wafer loading → alignment/calibration → OCR reading → BF/DF/DIC inspection → defect detection → golden die generation → auto/manual review → MES/EAP data output |
Post Seal Vision Handler - Tape and reel
|
Project Brief |
Inspect the sealing quality of packages after the sealing process and properly position them into tape-and-reel packaging. |
|
Product Brief |
Tape and reel |
|
Delivery Location |
CN |
|
Key Features |
● High-speed reel-to-reel inspection system ● Tape width ranging from 8,12,16, 24, 32 mm ● High Throughput With Dual Tracks Design ● Multiple Vision Systems with ±18µm accuracy, ● Fast Changeover for Different Carrier Tape Width ● Auto Labelling ● Defect detection (including seal integrity, marking, lead defects, and pocket bottom cracks) ● Optional SWIR/NIR cameras enable wafer-level crack detection down to 25µm. ● SECS/GEM ready for smart factory integration |
|
Process Coverage |
● Carrier Tape Handling (Reel-to-Reel) ● Vision Inspection (Post Seal) ● Reel Output & Marking |
Reel Packaging Automatic Line - Tape and reel
|
Project Brief |
Automatically places desiccant and humidity cards into the reel package, vacuum-seals the bag, and loads the bagged reel into a pizza box for final tape-and-reel packaging |
|
Product Brief |
Tape and reel |
|
Delivery Location |
CN |
|
Key Features |
- Connects to SFIS for automatic product pass-through. - Automatically removes the old label from the reel, prints a new label, and applies it to the reel. - Automatically inserts humidity indicator cards and desiccant packs. - Automatically heat-seals the aluminum foil bag. - Performs leak-tightness inspection of the sealed aluminum foil bag. - Automatically folds cardboard into a pizza box. - Loads the foil-bagged product into the pizza box. |
|
Process Coverage |
● Peel off legacy label ● Tape-and-reel loading ● Reel Label Print & Reel Labeling ● Packaging Desiccant ● Reel loaded into aluminum foil bag ● Moisture Barrier Card Packaging ● Vacuum Sealing ● Bubble Bag Packaging ● Pizza Box Carton Packaging Station ● Manual Carton Packing Station |
