(Source: Tanzhou Release)

            Recently, a significant piece of good news was announced from the Chinese Association for Artificial Intelligence. The semiconductor testing project, which was mainly completed by Guangdong Booster Technology Co., Ltd., a key enterprise in Tanzhou Town, has won the first prize of the Wu Wenjun Award for Progress in Artificial Intelligence. This is a major breakthrough in the integration of artificial intelligence and high-end manufacturing in Tanzhou Town.

The significance of the award

        The Wu Wenjun Artificial Intelligence Science and Technology Award is named after Wu Wenjun, a pioneer and leader in China's intelligent science research, and the first recipient of the National Highest Science and Technology Award. It was approved by the Ministry of Science and Technology and initiated and established by the Chinese Association for Artificial Intelligence. This award is an authoritative award in the field of intelligent science and technology in China, and is the only social force science and technology award in this field that has the qualification to nominate and recommend the National Science and Technology Awards. It is known as the 'Highest Award in China's Intelligent Science and Technology' and represents the highest level of technological innovation, industrial transformation, and industry leadership in the field of artificial intelligence in China. It is the 'highest certification' of the deep integration of intelligent technology and the real economy across the country.

Project Participation Status

Participants：Guangdong Booster Technology Co., Ltd. Deputy General Manager Xinmiao Zhou, Stanley Wong; Guangdong Booster Technology Co., Ltd. Professor Yu Xiaoyu, a scientific research expert, a supervisor of the graduate student base, and the chief engineer.

Participating content：In response to the standardized design concept of modular hardware and software and the rapid customization development needs of customers, we independently developed a native soft and hardware system platform based on flexible reconfiguration. According to the optimal envelope configuration of the tested product, it was constructed to achieve full coverage of testing functions. We also developed a new generation of self-controlled patterned wafer inspection equipment and integrated chip sorting and testing equipment, achieving large-scale sales for leading enterprises in the industry.

Technical breakthrough

This winning project focuses on the 'critical' problem of semiconductor testing and has achieved three revolutionary breakthroughs:

1、Innovations in Optical Imaging Systems：We have pioneered a high-dynamic range calculation optical imaging system with a wide field of view, integrating high-speed galvanometer scanning and real-time visual stitching technology. We have independently developed a laser automatic focusing system and innovatively constructed a dual-mode lens architecture of 'wide field of view initial screening - high-resolution rechecking'.

2、Breakthrough in intelligent algorithms：Overcoming the challenge of scarce sample resources for high defect rate scenarios, the detection rate of key defects has increased by 1.48 times compared to international competitors.

3、Innovative Flexible Testing Platform：The flexible reconfiguration test platform with 18-point free configuration enables the integration of the entire process of chip sorting, testing and packaging into a single 'N' system. The overall efficiency is improved by 10 times compared to traditional solutions.

The related technologies have cumulatively obtained 33 patent authorizations and 15 software copyrights. The core indicators have comprehensively outperformed those of international comparable equipment.